Surface-mount technology (SMT) is a method for producing electronic circuits in which
the components are mounted or placed directly onto the surface of printed circuit boards (PCBs).

The SMT production is equipped with:
Solder paste printers, 3D solder paste - inspection systems, SMT lines, reflow oven, automatic optical inspection system (AOI), X-Ray inspection and full automatic milling machines.

Through-hole technology (THT) is a method for mounting large electronics
components (e.g. connectors) on printed circuit boards (PCB). The components are manually
placed onto the PCB and the soldered by wave process.

The THT production is equipped with:
Manual mounting places, solder waves, in- circuit –test technology

The final assembly production produces fully automated.
After insertion of single components into the machine, the machine automatically
assembles the final product and verifies the functionality by a 100% test.